30 Mar '13, 1am

Mentor introduces thermal analysis into the design flow

Mentor introduces thermal analysis into the design flow

Mentor Graphics believes it is now possible implement thermal analysis of chips and PCBs at an early stage in the engineering design flow. The company aims to make thermal analysis of components, PCBs and enclosures part of the engineer’s design process and not the domain of thermal specialists. Mentor has combined the electronic and mechanical thermal analysis into a single design flow, with the introduction of the FloTHERM XT software suite. According to Keith Hanna, director of marketing, Mentor’s Mechanical Analysis division, designers are facing the challenge of increased processing speed, density, and power consumption of ICs, PCBs and electronic systems “The need for thermal analysis earlier in the design process is being driven by higher power processors, a seven-fold increase in PCB/component density,” said Hanna. “A consequence of this is design engineers are bei...

Full article: http://www.electronicsweekly.com/articles/18/03/2013/5577...

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