29 Oct '13, 4pm

SK Hynix Licenses BeSang's 3D IC | EE Times The Korean memory chip maker could field 3-D DRAM by 2014. via @eetimes

SK Hynix Licenses BeSang's 3D IC | EE Times The Korean memory chip maker could field 3-D DRAM by 2014. via @eetimes

PORTLAND, Ore. — SK Hynix Inc. in Icheon, South Korea, has licensed the 3D chip technology of BeSang Inc. of Beaverton, Oregon. SK Hynix, which mainly makes DRAM and flash memory chips, will license what BeSang (which in Korean means "flying high") calls its "True 3D IC" process, which uses a low-temperature process to build multilayer 3D integrated circuits one layer at a time using traditional vias, instead of stacking finished die using through-silicon-vias (TSVs). The patent-license agreement with SK Hynix calls for technology transfer including updates based on a service fee for a five-year period, but does not include collaboration. Also the agreement is non-exclusive, allowing BeSang the opportunity to strike similar deals with other chip manufacturers. BeSang’s 3D IC technology forms a single crystalline layer from a donor wafer and sequentially fabricates a second...

Full article: http://www.eetimes.com/document.asp?doc_id=1319938

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