Arduino Forum - Reflow advice

Reflow advice (jumping from the iron into the skillet). Lots of good advice in the comments

In the paste I have used a skillet but only to remove SMD components. You do have to be careful as the heat coming off the skillet can almost burn your face. I had my thermostat on 375F to melt the solder and remove the chip. I think 220C is too hot; 190 should be sufficient but only if the complete board touches the base of the skillet i.e. no thru-hole parts. I now have an inexpensive hot air rework station which is still hot but much more controllable. You definitely need extra solder of some kind to solder parts to a board. As you have found there is simply not enough solder on a tinned board. You should be able to do it by either putting solder either on the board or on the pads of a SMD chip. You should use plenty of flux when adding solder to a board. I use a water soluble flux pen and then ultrasonically clean the boards. Add the solder quickly with a stroke of the...

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