2D vs. 2.5D vs. 3D ICs 101: And speaking of package substrates (meaning the base layer), a variety of materials

2D vs. 2.5D vs. 3D ICs 101

eetimes.com 08 Apr '12, 4pm

2D vs. 2.5D vs. 3D ICs 101: And speaking of package substrates (meaning the base layer), a variety of materials

“the offspring resulting from crossbreeding.” Many would agree that this is an apt description for the species of electronic entities known as hybrids, which combine esoteric mixtures of interconnection and packaging technologies. In electronic terms, a hybrid consists of a collection of components mounted on a single insulating base layer called the substrate. A typical hybrid may contain a number of packaged or un-packaged integrated circuits and a variety of discrete components such as resistors, capacitors, and inductors, all attached directly to the substrate. Connections between the components are formed on the surface of the substrate; also, some components such as resistors and inductors may be fabricated directly onto the surface of the substrate.

Full article: http://www.eetimes.com/design/programmable-logic/4370596/...

Tweets

@Kurt_ing » 12 Apr '12, 6am
2D vs. 2.5D vs. 3D ICs 101: [link] via @ee_times
@mailtokatherine » 09 Apr '12, 7pm
2D vs. 2.5D vs. 3D ICs 101: And speaking of package substrates (meaning the base layer), a variety of materials ... [link]
@juicecasino » 09 Apr '12, 7pm
2D vs. 2.5D vs. 3D ICs 101 - EE Times: EE Times2D vs. 2.5D vs. 3D ICs 101EE Times[*Dies is used as the plural fo... [link]
@ajkk » 08 Apr '12, 4pm
2D vs. 2.5D vs. 3D ICs 101 - [link]
@Agilent_Digital » 08 May '12, 4am
2D vs. 2.5D vs. 3D ICs 101: [link] via @ee_times
@yasalbrmeek » 09 Apr '12, 10pm
2D vs. 2.5D vs. 3D ICs 101 - EE Times [link]
@ateliermarla » 09 Apr '12, 7pm
2D vs. 2.5D vs. 3D ICs 101: And speaking of package substrates (meaning the base layer), a variety of materials ... [link]