27 Feb '15, 4pm

New Article on Non-Stop #Innovation in #ChipPackaging : Download Within!

The semiconductor industry is entering the era of Internet of Things (IoT), where integration of sensing and actuation systems along with low power radio devices must be combined in a single package. For a large number of applications, the control of the devices will probably be done by handheld devices, so the overall footprint of the package is critical. The need for high performance multifunctional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented an enormous challenge, because all the individual components in the package must contact between their respective bond pads and the external board. To adapt to the needs of multifunctional devices, the packaging industry has attempted several approaches like package on package, silicon interposers and embedded package. Percolation of these vari...

Full article: http://www.eetimes.com/document.asp?doc_id=1325656&page_n...

Tweets

Semiconductor Innovation Yields Promise - EBN

Semiconductor Innovation Yields Promise - EBN

ebnonline.com 28 Feb '15, 4am

Despite challenges in the semiconductor industry, innovation continues. The evolution and refinement of a variety processe...

Need a 2+1 hdbpreferably non furnished

rentinsingapore.com 01 Mar '15, 7am

I want to let you know that I am a regular paid agent in your site posting many many ads month after ...

Microservers and mega-transceivers at #ISSCC vi...

eetimes.com 26 Feb '15, 4pm

SAN FRANCISCO — This year’s International Solid-State Circuits Conference once again served up a smorgasbord of silicon in...

Can packaging be both luxurious and sustainable?

luxurydaily.com 24 Feb '15, 7am

Ian Lifshitz is North American director of sustainability and stakeholder relations at Asia Pulp and Paper Group By Ian Li...

Graphene Polymer Speeds Electron Transport - EE...

eetimes.com 27 Feb '15, 4pm

PORTLAND, Ore. — Graphene is considered by many as the successor to silicon because its electron mobility can be over 10X ...

Android For Work Brings Google To The Office - EE Times

Android For Work Brings Google To The Office - ...

eetimes.com 26 Feb '15, 6am

Google aims to make Android better suited to the demands of businesses. Google on Wednesday introduced Android for Work , ...

Download the new book by Jon Titus: Experiments for the Propeller Quickstart

Download the new book by Jon Titus: Experiments...

parallax.com 27 Feb '15, 10pm

Jon Titus and Parallax. Thanks for the Doc and code. I have Propeller Quickstart and BOE (after several BS2's) and really ...

Mesh Comes to Bluetooth | EE Times via @eetimes

eetimes.com 26 Feb '15, 9am

PARIS — Expect Bluetooth to add mesh networking technology later this year. Mesh technology is regarded as a key to many I...

[EE Times Japan]電子ブックレット:量子力学のパイオニアに聞く! 量子コンピュー...

eetimes.jp 27 Feb '15, 10pm

EE Times 海外ネットワーク EE Times EE Times Asia EE Times China EE Times Europe EE Times India EE Times Korea EE Times Taiwan EE T...

Chapter Puglia GBC Italia: Green Business Innovation – Moduli seminariali green a Bari

Chapter Puglia GBC Italia: Green Business Innov...

gbcitalia.org 27 Feb '15, 9am

, ha vinto il bando pubblico indetto dall’ARTI Puglia, nell’ambito del progetto Green Business Innovation cofinanziato dal...