29 Dec '15, 4pm

More Than Moore: Finally Crossing the Chasm?

More Than Moore: Finally Crossing the Chasm?

I think we can draw some interesting observations from these Early Market applications. The original hype surrounding 3D-IC was that it offered a means to continue down a new scaling path by packing transistors closer together, with fine partitioning of logic on adjacent dies. In the Early Market applications we’ve seen to date, this really hasn’t come to pass. These 2.5/3D-IC applications used coarse design partitioning, and gained benefits other than speed by more closely packing transistors. 3D-IC has brought real value to these early applications, but not by solving the Moore’s Law scaling problem, as so broadly predicted.

Full article: http://electronicdesign.com/eda/more-moore-finally-crossi...

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