25 May '16, 10pm
IoT requirement for Ultra dense 3-D packaging
LAKE WALES, Fla.—Smoltek AB (Gothenburg, Sweden) is dedicated to superseding Moore's Law, which merely scales the size of transistors, with what it believes is the more urgent need to reduce the size of electronic packages. After all, the smaller the package the thinner the smartphone or other Internet of Thing (IoT) device. Today's System on chip (SoC) and System in Package (SiP) technologies are good starts, according to Smoltek. However, the continued scaling down of the size of packages with novel technologies will be the legacy of the 21st century, Smoltek believes. The company claims to have solved the major bottleneck facing package shrinking with its 3-D carbon-based nanostructure interconnects. In more detail, the International Technology Roadmap for Semiconductors (ITRS ) hits the end of transistor scaling possibilities at the atomic level circa 2025. According t...