24 Oct '12, 2am

Intel has no advantage in process technology for mobile ICs, says ARM CEO

Intel has no advantage in IC manufacturing when it comes to manufacturing processes used for mobile ICs, Warren East, CEO of ARM, tells EW. "This time last year there was a lot of noise from the Intel camp about their manufacturing superiority," says East, "we’re sceptical about this because, while the ARM ecosystem was shipping on 28nm, Intel was shipping on 32nm. So I don’t see where they’re ahead." Furthermore, with the foundries accelerating their process development timescales, it looks increasingly unlikely that Intel will be able to find any advantage on mobile process technology in the future. "We’re supporting all the independent foundries," says East. That includes 20nm planar bulk CMOS and 16nm finfet at TSMC; 20nm planar bulk CMOS and 14nm finfet at Samsung and 20nm planar bulk CMOS, 20nm FD-SOI and 14nm finfet at Globalfoundries. It gives the ARM ecosystem a f...

Full article: http://www.electronicsweekly.com/Articles/24/10/2012/5484...

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