Electronic Engineering Times is the industry resource for news, analysis, design ideas & solutions, products, education, & engaging with the EE community.
Link: eetimes.com
On one hands, government was blame of inefficiency and of being slow in reacting to the market. On the other hands, when there is a research gap, it is because of lack of government funding. Lack of government funding may be one of the many contributors to the slow to technology advan...
LONDON – The Embedded Microprocessor Benchmark Consortium (EEMBC) has announced that a working group has been set up to create an energy-efficiency benchmark for microcontrollers. The working group project is being extended to add to results originally produced in 2011. The working gr...
PARIS – Will fully depleted silicon on insulator (FDSOI) become a viable alternative to FinFET? Semiconductor industry insiders have been asking this question for months. FDSOI, is an approach that supposedly delivers the benefits of reduced silicon geometries while enabling a simplif...
BRUSSELS, Belgium – The European Commission has launched a campaign of public investment in micro- and nanoelectronics with the aim of doubling chip production on the continent to around 20 percent of global production. The plan is to channel more than 5 billion euro (about $6.4 billi...
MOUNTAIN VIEW, Calif. – The party’s not over yet, but it’s getting time we start thinking about calling a cab. That’s Henry Samueli’s view of the semiconductor industry in a nutshell. The chief technology officer of Broadcom Corp. was shockingly frank in an on-stage interview at an ev...
SAN JOSE, Calif. – Intel will pack a voltage regulator on to its next generation Haswell processor, eliminating as many as seven external third party chips. The news was one of a few details Intel revealed in a Haswell briefing the same day its archrival Advanced Micro Devices announc...
MOUNTAIN VIEW, Calif. – The party’s not over yet, but it’s getting time we start thinking about calling a cab. That’s Henry Samueli’s view of the semiconductor industry in a nutshell. The chief technology officer of Broadcom Corp. was shockingly frank in an on-stage interview at an ev...
BRUSSELS, Belgium – IM Flash Technologies LLC (Lehi, Utah), the joint venture between Intel and Micron Technologies, is considering how and when to take its NAND flash memory ICs into the third dimension but reckons its development of a 20-nm memory cell has bought it a generation or ...
