29 Sep '17, 6pm

Die Handling Critical in Flex Electronics

Wearables require flexible hybrid electronics with die thinned to less than 30mum, and handling these ultrathin die is turning out to be a critical part of the manufacturing process. Ultrathin die (<50 µm) have been in production for years in stacked 3D ICs. Building on this experience, NextFlex is developing new manufacturing processes that integrate ultrathin die onto flexible substrates. Availability of ultrathin die for development and prototyping is currently a major hurdle to creating flexible hybrid electronics for the wearables market. Working with Disco, a dicing and thinning equipment supplier, NextFlex has produced stress-free ultrathin wafers and die with thicknesses as low as 10 µm. This capability will enable ultrathin die to be made available both to the institute’s member base and to the commercial market. Once wafers are thinned and the die singulated onto...

Full article: http://www.eetimes.com/author.asp?section_id=36&doc_id=13...

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