30 Oct '17, 7pm

The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications

These requirements have posed significant challenges to photonic device manufacturing. To support data center build-up, the photonic device companies need to maintain an “elastic capacity model” to respond fast to data center customer’s demands, and at the same time to maintain low manufacturing costs to produce profits. This calls for much higher levels of manufacturing automation than the photonic industry ever had before. In addition, the co-existence of many product standards requires that the manufacturing automation is flexible so multiple products, e.g., single die Fabry-Perot (FP) laser submount and multiple die electro-absorption laser (EML) submount assembly, can go through the same production lines without sacrificing throughput. Furthermore, more and more advanced technologies demand higher and higher precision in assembly automations, again without sacrificing...

Full article: https://spectrum.ieee.org/webinar/the-challenges-in-high-...

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