30 Dec '11, 7pm

Moore's law seems to become extended by 3D opportunities for chips. Good summary on

Vertical stacks of TSV-enabled chips are not far behind 2.5D technology. Elpida, Micron, Samsung, and Toshiba are all in various stages of creating memory stacks built with TSVs. Some of these companies have already shipped prototype chips to customers, and industry watchers expect TSV-based high-end memory—the sort that would be useful for servers and high-performance ­computers—to emerge in 2012. "We'll see [TSVs] start to come out in applications where cost is not the main concern but performance is," says Jim Walker , a vice president of research at Gartner who follows packaging ­developments. Memory chips are a natural entry point for new 3-D technology because they are more tolerant of thermal stress, Walker says. Chipmakers, he says, still haven't found a good way to carry heat out of the middle of a stack. The problem is particularly thorny when the stacks contain ...

Full article: http://spectrum.ieee.org/semiconductors/devices/3d-chips-...

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3-D Chips Grow Up

spectrum.ieee.org 30 Dec '11, 6pm

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spectrum.ieee.org 30 Dec '11, 6pm

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LG's 84-inch ultra definition (3840 x 2160 pixels) 3D TV to be unveiled at CES 2012 #ces2012

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Expandable willow trellises : These handsome trellises are made of willow and come in three sizes. The large size is 70 in...

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3D printing is taking shape:

spectrum.ieee.org 01 Jan '12, 10am

The promise of 3-D printing is tantalizing: You envision something, draw it with the right software, and then print it in ...

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Is 3D IC Packaging Ready For Prime Time? @IBM w...

electronicdesign.com 28 Dec '11, 5pm

Fig 1. Micron Technology’s Hybrid Memory Cube (HMC), a 3D IC with TSVs, is making use of IBM’s 3D IC expertise. It will ac...