29 Apr '14, 5am

Winbond to hike 2014 capex for capacity ramps

Winbond to hike 2014 capex for capacity ramps Josephine Lien, Taipei; Steve Shen, DIGITIMES [Tuesday 29 April 2014] Taiwan-based specialty DRAM and NOR flash maker Winbond Electronics will increase its capex for 2014 in order to ramp up its production capacity to meet increasing demand for specialty DRAM and flash chips from the smartphone, Internet of Things (IoT) and wearable device sectors, according to the company. Under the plan, the company will hike its 2014 capex from the original NT$8.6 billion (US$284 million) to NT$10.6 billion, mainly for expanding its production of 12-inch wafers from 33,000 units a month to 40,000 units, as well as the production of 46nm specialty DRAM chips and 58nm NOR flash chips. Meanwhile, Winbond expects its consolidated revenues to grow another 10% sequentially in the second quarter of 2014 after seeing its revenues edge up 5% on quart...

Full article: http://www.digitimes.com/news/a20140428PD220.html

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