19 Oct '15, 6pm

Discover the path to a defect-free SMT process using automotive PoP technology w/this @EDNcom article:

Discover the path to a defect-free SMT process using automotive PoP technology w/this @EDNcom article:

Optimizing speed and time are not only the ingredients to fulfill gold medal aspirations on the Olympic track, but the prerequisites to a robust surface mount (SMT) process of memory to bottom (logic) package attach for package-on-package technology (PoP). PoP technology has galvanized semiconductor packaging due to its innate benefits of reduced form factor footprint and miniaturization supporting a plethora of consumer and portable electronic products in high volume manufacturing (HVM). Due to its robust HVM history over the course of more than a decade, PoP is an ideal technology for automotive advanced driver assistance systems (ADAS) applications requiring memory/processor integration. Understanding the impact of SMT parameters Ensuring proper flux coverage on memory balls begins with understanding the dynamics of deposition time in flux reservoir and the speed associ...

Full article: http://www.edn.com/design/systems-design/4440425/Path-to-...

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