30 Nov '15, 10pm

Researchers Move Liquid Cooling Up Against FPGA Chips

Researchers Move Liquid Cooling Up Against FPGA Chips

With computer chips growing more powerful, there is significant demand for advanced cooling systems that can dissipate the large amounts of heat produced by ultrafast processors. Now, a research team from the Georgia Institute of Technology has found a method to move liquid cooling directly onto the chip, carving trenches into the backside of field-programmable gate arrays (FPGAs). The research team began with stock 28-nm Altera FPGA chips, removing the heat sink and heat spreading materials. The researchers etched cooling passages into the silicon, incorporating silicon cylinders approximately 100 µ in diameter to improve heat transmission into the liquid. Next, a silicon layer was placed over the microfluidic passages and ports were attached for the water tubes, which pumped deionized water over the chip. Related Graphene-Based Film Could Be Future of Cooling Microelectr...

Full article: http://electronicdesign.com/microprocessors/researchers-m...

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