30 Aug '16, 11am

Korean process engineers develop packaging technology to create flexible integrated circuits

Korean process engineers develop packaging technology to create flexible integrated circuits

The process starts with a flash memory wafer diced after thinning to ~100nm. These die are attached to a plastic carrier film, which allows them to be transferred to a roller and pressed onto a flexible PCB supported by a flat plate. The team suggests tolerance control is such that multiple die can simultaneously be applied to multiple PCBs by a single roller. Thermo-compression bonding attaches the die to the PCB because between the die and PCBs is a thin sheet consisting of conductive particles sparsely-distributed in an solid bonding medium – an ‘anisotropic conductive film’ (ACF). Once compressed and heated, the ACF conducts through its thickness – making connections between die and PCB – without forming short-circuits because it does not conduct sideways. ACF conducts only where its particles are compressed sufficiently “The final silicon-based flexible NAND memory de...

Full article: http://www.electronicsweekly.com/news/research-news/korea...

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