23 Apr '17, 6am

ARTICLE: Improve device reliability via PCB cleanliness via @EDNcom #mfg

ARTICLE: Improve device reliability via PCB cleanliness via @EDNcom #mfg

No-lead solder is a relatively recent legislated fact of life that necessitated new solder, new fluxes, higher temperatures, and new solder processing equipment. Many new approaches, alloys, chemicals, and soldering processes have been developed to address these issues. Tin whisker problems also increased dramatically. Time-delayed effects, however, often will not show up until a product is out the door and has been in service for even a year or two. The pace of product development covers up some of these time-delayed issues when products are routinely discarded for newer models. For products such as mobile phones, problems don’t often show up because comparatively few people are using a mobile phone that is more than 2-3 years old. Few will spend money for repair when an upgraded feature-rich model is available at a subsidized price. For medical devices, however, the pote...

Full article: http://www.edn.com/design/pc-board/4437935/Improve-device...

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