31 May '17, 9pm

Intel's #3DXP gets mixed reviews as a 2018 server #memory - latency is an issue

Intel's #3DXP gets mixed reviews as a 2018 server #memory - latency is an issue

SAN JOSE, Calif. — Opinions are mixed on whether Intel’s 3D XPoint will open a door to disruptive server designs next year. Some believe the chips cannot hit the latency levels needed for main memory, some believe they will, and others are sitting on the fence. 3DXP is the first of a half-dozen storage-class memories (SCM) expected to emerge over the next three years. They will enable a range of new options in memory capacity and speed. Engineers are working on interfaces for the new chips, but they are largely unfinished and their future somewhat unclear. Flash-memory analyst Jim Handy is bullish on SCM in general and 3DXP in particular. At its 2015 launch, he predicted that Intel could reap $2 billion in the first two years of 3DXP revenues. It’s taken Intel and Micron longer to ramp the co-developed design, which uses novel and still-undisclosed materials. Nevertheless,...

Full article: http://www.eetimes.com/document.asp?doc_id=1331826

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